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 | 2003 | |
|---|---|---|
| j2 |      | T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu: Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. Microelectronics Reliability 43(5): 803-809 (2003) |
| 2002 | ||
| j1 | | T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai: The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectronics Reliability 42(3): 375-380 (2002) |
| 1 | J. W. Chai | |
| 2 | K. H. Chua | |
| 3 | Simon Chua | |
| 4 | K. L. Davison | |
| 5 | W. S. Leong | |
| 6 | T. Y. Lin | |
| 7 | Y. Miao | |
| 8 | R. Oh | |
| 9 | W. C. Tjiu | |
| 10 | K. C. Toh | |
| 11 | Y. F. Yao |
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