Mohit Pathak

David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang: Design for manufacturability and reliability for TSV-based 3D ICs. ASP-DAC 2012: 750-755

Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim: Exploiting die-to-die thermal coupling in 3D IC placement. DAC 2012: 741-746

Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim: 3D-MAPS: 3D Massively parallel processor with stacked memory. ISSCC 2012: 188-190

Mohit Pathak, Jiwoo Pak, David Z. Pan, Sung Kyu Lim: Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs. ICCAD 2011: 555-562

Michael B. Healy, Krit Athikulwongse, Rohan Goel, Mohammad M. Hossain, Dae Hyun Kim, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Moongon Jung, Brian Ouellette, Mohit Pathak, Hemant Sane, Guanhao Shen, Dong Hyuk Woo, Xin Zhao, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim: Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory. CICC 2010: 1-4

Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Kyu Lim: Through-silicon-via management during 3D physical design: When to add and how many? ICCAD 2010: 387-394

Mohit Pathak, Sung Kyu Lim: Performance and Thermal-Aware Steiner Routing for 3-D Stacked ICs. IEEE Trans. on CAD of Integrated Circuits and Systems 28(9): 1373-1386 (2009)

Mohit Pathak, Sung Kyu Lim: Thermal-aware Steiner routing for 3D stacked ICs. ICCAD 2007: 205-211

Mohit Pathak, Souvik Mukherjee, Madhavan Swaminathan, Ege Engin, Sung Kyu Lim: Placement and routing of RF embedded passive designs in LCP substrate. ICCD 2007: 273-279

Jacob R. Minz, Mohit Pathak, Sung Kyu Lim: Net and Pin Distribution for 3D Package Global Routing. DATE 2004: 1410-1411