Richard B. R. van Silfhout

Sander Noijen, Roy Engelen, Joerg Martens, Alexandru Opran, Olaf van der Sluis, Richard B. R. van Silfhout: Prediction of the epoxy moulding compound aging effect on package reliability. Microelectronics Reliability 50(7): 917-922 (2010)

M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen: Virtual qualification of moisture induced failures of advanced packages. Microelectronics Reliability 47(2-3): 273-279 (2007)

Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout: Molecular simulation on the material/interfacial strength of the low-dielectric materials. Microelectronics Reliability 47(9-11): 1483-1491 (2007)

Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, M. A. J. van Gils: Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. Microelectronics Reliability 47(12): 1975-1982 (2007)

C. Yuan, W. D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, R. A. B. Engelen, Leo J. Ernst, F. van Keulen, G. Q. Zhang: Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectronics Reliability 46(9-11): 1679-1684 (2006)

W. D. van Driel, M. A. J. van Gils, Richard B. R. van Silfhout, G. Q. Zhang: Prediction of Delamination Related IC & Packaging Reliability Problems. Microelectronics Reliability 45(9-11): 1633-1638 (2005)