| 2009 | ||
|---|---|---|
| j16 | Wolfgang Stadler, Tilo Brodbeck, Reinhold Gärtner, Harald Gossner: Do ESD fails in systems correlate with IC ESD robustness? Microelectronics Reliability 49(9-11): 1079-1085 (2009) | |
| j15 | Vesselin K. Vassilev, Wolfgang Stadler: Editorial ESD reliability special section. Microelectronics Reliability 49(12): 1405-1406 (2009) | |
| j14 | Adrien Ille, Wolfgang Stadler, Thomas Pompl, Harald Gossner, Tilo Brodbeck, Kai Esmark, Philipp Riess, David Alvarez, Kiran V. Chatty, Robert Gauthier, Alain Bravaix: Reliability aspects of gate oxide under ESD pulse stress. Microelectronics Reliability 49(12): 1407-1416 (2009) | |
| j13 | Michael Heer, Krzysztof Domanski, Kai Esmark, Ulrich Glaser, Dionyz Pogany, Erich Gornik, Wolfgang Stadler: Transient interferometric mapping of carrier plasma during external transient latch-up phenomena in latch-up test structures and I/O cells processed in CMOS technology. Microelectronics Reliability 49(12): 1455-1464 (2009) | |
| j12 | Tilo Brodbeck, Kai Esmark, Wolfgang Stadler: CDM tests on interface test chips for the verification of ESD protection concepts. Microelectronics Reliability 49(12): 1470-1475 (2009) | |
| 2007 | ||
| j11 | ||
| j10 | V. Dubec, Sergey Bychikhin, Dionyz Pogany, Erich Gornik, Tilo Brodbeck, Wolfgang Stadler: Backside interferometric methods for localization of ESD-induced leakage current and metal shorts. Microelectronics Reliability 47(9-11): 1539-1544 (2007) | |
| 2006 | ||
| j9 | Krzysztof Domanski, B. Póltorak, S. Bargstädt-Franke, Wolfgang Stadler, W. Bala: Physical fundamentals of external transient latch-up and corrective actions. Microelectronics Reliability 46(5-6): 689-701 (2006) | |
| 2005 | ||
| j8 | ||
| j7 | Wolfgang Stadler, Kai Esmark, K. Reynders, M. Zubeidat, M. Graf, Wolfgang Wilkening, J. Willemen, N. Qu, S. Mettler, M. Etherton: Test circuits for fast and reliable assessment of CDM robustness of I/O stages. Microelectronics Reliability 45(2): 269-277 (2005) | |
| j6 | Heinrich Wolf, Horst A. Gieser, Wolfgang Stadler, Wolfgang Wilkening: Capacitively coupled transmission line pulsing cc-TLP--a traceable and reproducible stress method in the CDM-domain. Microelectronics Reliability 45(2): 279-285 (2005) | |
| j5 | S. Bargstädt-Franke, Wolfgang Stadler, Kai Esmark, Martin Streibl, Krzysztof Domanski, Horst A. Gieser, Heinrich Wolf, W. Bala: Transient latch-up: experimental analysis and device simulation. Microelectronics Reliability 45(2): 297-304 (2005) | |
| j4 | Martin Streibl, F. Zängl, Kai Esmark, Robert Schwencker, Wolfgang Stadler, Harald Gossner, S. Drüen, Doris Schmitt-Landsiedel: High abstraction level permutational ESD concept analysis. Microelectronics Reliability 45(2): 313-321 (2005) | |
| 2003 | ||
| j3 | Martin Streibl, Kai Esmark, A. Sieck, Wolfgang Stadler, M. Wendel, J. Szatkowski, Harald Gossner: Harnessing the base-pushout effect for ESD protection in bipolar and BiCMOS technologies. Microelectronics Reliability 43(7): 1001-1010 (2003) | |
| 2002 | ||
| j2 | Wolfgang Stadler, Kai Esmark, Harald Gossner, Martin Streibl, M. Wendel, Wolfgang Fichtner, Dionyz Pogany, Martin Litzenberger, Erich Gornik: Device Simulation and Backside Laser Interferometry--Powerful Tools for ESD Protection Development. Microelectronics Reliability 42(9-11): 1267-1274 (2002) | |
| 2001 | ||
| j1 | Kai Esmark, Wolfgang Stadler, M. Wendel, Harald Gossner, X. Guggenmos, Wolfgang Fichtner: Advanced 2D/3D ESD device simulation - a powerful tool already used in a pre-Si phase. Microelectronics Reliability 41(11): 1761-1770 (2001) | |
| 1993 | ||
| c1 | Wolfgang Stadler: Einführung verteilter Systeme in einem Unternehmen der Markenartikelindustrie - Organisatorische Konsequenzen. GI-Fachgespräch über Rechenzentren 1993: 128-134 | |
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