Andrew J. G. Strandjord

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	2002
j1		Andrew J. G. Strandjord, Scott Popelar, Christine Jauernig: Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding). Microelectronics Reliability 42(2): 265-283 (2002)

Coauthor Index

1	Christine Jauernig	[j1]
2	Scott Popelar	[j1]

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