| 2005 | ||
|---|---|---|
| j3 | F. Palumbo, G. Condorelli, Salvatore Lombardo, K. L. Pey, C. H. Tung, L. J. Tang: Structure of the oxide damage under progressive breakdown. Microelectronics Reliability 45(5-6): 845-848 (2005) | |
| 2004 | ||
| j2 | C. F. Tsang, C. Y. Li, A. Krishnamoorthy, Y. J. Su, H. Y. Li, L. Y. Wong, W. H. Li, L. J. Tang, K. Y. Ee: Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. Microelectronics Journal 35(9): 693-700 (2004) | |
| 2003 | ||
| j1 | K. L. Pey, C. H. Tung, M. K. Radhakrishnan, L. J. Tang, Y. Sun, X. D. Wang, W. H. Lin: Correlation of failure mechanism of constant-current-stress and constant-voltage-stress breakdowns in ultrathin gate oxides of nMOSFETs by TEM. Microelectronics Reliability 43(9-11): 1471-1476 (2003) | |
Colors in the list of coauthors
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