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 | 2010 | |
|---|---|---|
| j5 |      | Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere: Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. Microelectronics Reliability 50(4): 498-506 (2010) |
| 2009 | ||
| j4 | | S. T. Jenq, Hsuan-Hu Chang, Yi-Shao Lai, Tsung-Yueh Tsai: High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys. Microelectronics Reliability 49(3): 310-317 (2009) |
| 2008 | ||
| j3 | | Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen: Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. Microelectronics Reliability 48(5): 757-762 (2008) |
| 2007 | ||
| j2 | | Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen: Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. Microelectronics Reliability 47(8): 1239-1245 (2007) |
| j1 | | Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai: Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. Microelectronics Reliability 47(12): 2188-2196 (2007) |
| 1 | Hsuan-Hu Chang | |
| 2 | Rong-Sheng Chen | |
| 3 | Matthew Giere | |
| 4 | Bruce Guenin | |
| 5 | S. T. Jenq | |
| 6 | Chin-Li Kao | |
| 7 | Yi-Shao Lai | |
| 8 | James G. Mitchell | |
| 9 | Darko Popovic | |
| 10 | Jing Shi | |
| 11 | Theresa Sze | |
| 12 | Chang-Lin Yeh |
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