R. L. J. M. Ubachs

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	2010
j3		R. L. J. M. Ubachs: Electromigration in WLCSP solder bumps. Microelectronics Reliability 50(9-11): 1678-1683 (2010)
	2006
j2		R. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang: Multiscale modelling of multilayer substrates. Microelectronics Reliability 46(9-11): 1472-1477 (2006)
j1		W. D. van Driel, Olaf van der Sluis, D. G. Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang: Reliability modelling for packages in flexible end-products. Microelectronics Reliability 46(9-11): 1880-1885 (2006)

Coauthor Index

1	G. Aflenzer	[j1]
2	Willem D. van Driel (W. D. van Driel)	[j2] [j1]
3	Olaf van der Sluis	[j2] [j1]
4	D. G. Yang	[j1]
5	C. Zenz	[j1]
6	G. Q. Zhang (G. Q. (Kouchi) Zhang)	[j2] [j1]

Last update Fri May 24 04:26:27 2013 CET by the DBLP Team —

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