Tahui Wang

M. H. Lin, M. T. Lin, Tahui Wang: Effects of length scaling on electromigration in dual-damascene copper interconnects. Microelectronics Reliability 48(4): 569-577 (2008)

M. H. Lin, K. P. Chang, K. C. Su, Tahui Wang: Effects of width scaling and layout variation on dual damascene copper interconnect electromigration. Microelectronics Reliability 47(12): 2100-2108 (2007)

M. H. Lin, Y. L. Lin, K. P. Chang, K. C. Su, Tahui Wang: Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. Microelectronics Reliability 45(7-8): 1061-1078 (2005)

Tahui Wang, Sheng-Jyh Wu, Chimoon Huang: Device and circuit simulation of anomalous DX trap effects in DCFL and SCFL HEMT inverters. IEEE Trans. on CAD of Integrated Circuits and Systems 12(11): 1758-1761 (1993)