| 2011 | ||
|---|---|---|
| c5 | Katsuya Kikuchi, Chihiro Ueda, Fumiaki Fujii, Yutaka Akiyama, Naoya Watanabe, Yasuhiro Kitamura, Toshio Gomyo, Toshikazu Okubo, Tetsuya Koyama, Tadashi Kamada, Masahiro Aoyagi, Kanji Otsuka: PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system. 3DIC 2011: 1-4 | |
| c4 | Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Tanemasa Asano: Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration. 3DIC 2011: 1-4 | |
| c3 | Naoya Watanabe, Takumi Miyazaki, Masahiro Aoyagi, Kazuhiro Yoshikawa: Damage evaluation of wet-chemical silicon-wafer thinning process. 3DIC 2011: 1-4 | |
| 2005 | ||
| j2 | Akira Yamazaki, Fukashi Morishita, Naoya Watanabe, Teruhiko Amano, Masaru Haraguchi, Hideyuki Noda, Atsushi Hachisuka, Katsumi Dosaka, Kazutami Arimoto, Setsuo Wake, Hideyuki Ozaki, Tsutomu Yoshihara: A Study of Sense-Voltage Margins in Low-Voltage-Operating Embedded DRAM Macros. IEICE Transactions 88-C(10): 2020-2027 (2005) | |
| 1991 | ||
| j1 | Jaime Jungok Bae, Tatsuya Suda, Naoya Watanabe: Evaluation of the Effects of Protocol Processing Overhead in Error Recovery Schemes for a High-Speed Packet Switched Network: Link-by-Link versus Edge-to-Edge Schemes. IEEE Journal on Selected Areas in Communications 9(9): 1496-1509 (1991) | |
| 1986 | ||
| c2 | Naoya Watanabe, Ken-ichi Yukimatsu, Toshiaki Doi, Masachika Ishizura, Etsugo Yoneda, Makoto Kawashima, Kazuhiro Hayashi: Network Testing for Digital Data Networks. ICC 1986: 588-592 | |
| c1 | Ken-ichi Yukimatsu, Naoya Watanabe, Takashi Honda: Multicast Communication Facilities in a High Speed Packet Switching Network. ICCC 1986: 276-281 | |
Colors in the list of coauthors
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