| 1998 | ||
|---|---|---|
| j1 | Keith K. H. Wong, Suryanarayana Kaja, Patrick W. DeHaven: Metallization by plating for high-performance multichip modules. IBM Journal of Research and Development 42(5): 587-596 (1998) | |
| 1 | Patrick W. DeHaven | |
| 2 | Suryanarayana Kaja |
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