J. D. Wu

List of publications from the DBLP Bibliography Server - FAQ
Other views: by type - by year (modern) - classic-C

Ask others: ACM DL/Guide -

	2006
j6		J. D. Wu, P. J. Zheng, C. W. Lee, S. C. Hung, J. J. Lee: A study in flip-chip UBM/bump reliability with effects of SnPb solder composition. Microelectronics Reliability 46(1): 41-52 (2006)
j5		Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang: Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. Microelectronics Reliability 46(12): 2104-2111 (2006)
	2003
j4		J. D. Wu, C. Y. Huang, C. C. Liao: Fracture strength characterization and failure analysis of silicon dies. Microelectronics Reliability 43(2): 269-277 (2003)
j3		Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu, S. C. Hung: Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls. Microelectronics Reliability 43(6): 925-934 (2003)
	2002
j2		J. D. Wu, S. H. Ho, C. Y. Huang, C. C. Liao, P. J. Zheng, S. C. Hung: Board level reliability of a stacked CSP subjected to cyclic bending. Microelectronics Reliability 42(3): 407-416 (2002)
	2001
j1		S. C. Hung, P. J. Zheng, S. H. Ho, S. C. Lee, H. N. Chen, J. D. Wu: Board level reliability of PBGA using flex substrate. Microelectronics Reliability 41(5): 677-687 (2001)

Coauthor Index

Last update Tue May 21 21:30:21 2013 CET by the DBLP Team —

Data released under the ODC-BY 1.0 license — See also our legal information page