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Bernhard Wunderle
2010 – today
- 2012
[j6]O. Hölck, Jörg Bauer, Olaf Wittler, Bernd Michel, Bernhard Wunderle: Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination. Microelectronics Reliability 52(7): 1285-1290 (2012)- 2011
- [j5]O. Hölck, E. Dermitzaki, Bernhard Wunderle, Jörg Bauer, Bernd Michel: Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling. Microelectronics Reliability 51(6): 1027-1034 (2011)
- 2010
- [j4]Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, H. Walter, Q. Shaik, K. Rätzke, F. Faupel, Bernd Michel, Herbert Reichl: Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling. Microelectronics Reliability 50(7): 900-909 (2010)
2000 – 2009
- 2009
- [c1]Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle, Herbert Reichl: 3-D thin chip integration technology - from technology development to application. 3DIC 2009: 1-8
- 2007
- [j3]Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel: Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectronics Reliability 47(2-3): 187-195 (2007)
- [j2]M. Spraul, W. Nüchter, A. Möller, Bernhard Wunderle, Bernd Michel: Reliability of SnPb and Pb-free flip-chips under different test conditions. Microelectronics Reliability 47(2-3): 252-258 (2007)
- 2006
- [j1]Bernhard Wunderle, Bernd Michel: Progress in reliability research in the micro and nano region. Microelectronics Reliability 46(9-11): 1685-1694 (2006)
Coauthor Index
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last updated on 2012-12-02 20:58 CET by the dblp team