Artur Wymyslowski

Artur Wymyslowski, Lukasz Dowhan: Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials. Microelectronics Reliability 53(3): 443-451 (2013)

Artur Wymyslowski: 2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectronics Reliability 52(7): 1253-1254 (2012)

E. R. Weltevreden, S. J. Tesarski, Artur Wymyslowski, M. Erinc, A. W. J. Gielen: A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging. Microelectronics Reliability 52(7): 1300-1305 (2012)

Artur Wymyslowski: 2010 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectronics Reliability 51(6): 1025-1026 (2011)

Lukasz Dowhan, Artur Wymyslowski, Pawel Janus, Magdalena Ekwinska, Olaf Wittler: Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods. Microelectronics Reliability 51(6): 1046-1053 (2011)

Lukasz Dowhan, Artur Wymyslowski, Stanislaw Kalicinski, Pawel Janus: Numerical prototyping methods in microsystem accelerometers design. Microelectronics Reliability 51(7): 1276-1282 (2011)

Artur Wymyslowski: Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectronics Reliability 50(7): 891-892 (2010)

Artur Wymyslowski: Guest Editorial: 2008 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectronics Reliability 49(8): 823-824 (2009)

Artur Wymyslowski: Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectronics Reliability 48(6): 803-804 (2008)

Lukasz Dowhan, Artur Wymyslowski, Rainer Dudek: An approach of numerical multi-objective optimization in stacked packaging. Microelectronics Reliability 48(6): 851-857 (2008)

Artur Wymyslowski, Bart Vandevelde, Dag Andersson: Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectronics Reliability 47(2-3): 159-160 (2007)

Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang: Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. Microelectronics Reliability 47(2-3): 280-289 (2007)

Tomasz Falat, Artur Wymyslowski, Jana Kolbe: Numerical approach to characterization of thermally conductive adhesives. Microelectronics Reliability 47(2-3): 342-346 (2007)

Artur Wymyslowski: Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectronics Reliability 47(12): 1967-1968 (2007)

Tomasz Falat, Artur Wymyslowski, Jana Kolbe, Kaspar M. B. Jansen, Leo J. Ernst: Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach. Microelectronics Reliability 47(12): 1989-1996 (2007)