Ching-Kun Yang Coauthor index pubzone.org

List of publications from the DBLP Bibliography Server - FAQ
Other views: by type - by year (modern) - classic-C
Ask others: ACM DL/Guide - CiteSeerX - CSB - MetaPress - Google - Bing - Yahoo
DBLP keys2004
c1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XML
Fang-Chung Yang, Chung-Hsien Kuo, Jein-Jong Wing, Ching-Kun Yang: Reconstructing the 3D solder paste surface model using image processing and artificial neural network. SMC (3) 2004: 3051-3056

Coauthor Index

1Chung-Hsien Kuo
[c1]
2Jein-Jong Wing
[c1]
3Fang-Chung Yang
[c1]
Home | Conferences | Journals | Series | FAQ — Search: Faceted | Free | Complete | Author
Last update Mon May 20 08:31:33 2013 CET by the DBLP Team — This material is Open Data Data released under the ODC-BY 1.0 license — See also our legal information page