G. Q. Zhang

S. Tarashioon, A. Baiano, Henk van Zeijl, C. Guo, S. W. Koh, W. D. van Driel, G. Q. Zhang: An approach to "Design for Reliability" in solid state lighting systems at high temperatures. Microelectronics Reliability 52(5): 783-793 (2012)

R. H. Poelma, H. Sadeghian, S. Koh, G. Q. Zhang: Effects of single vacancy defect position on the stability of carbon nanotubes. Microelectronics Reliability 52(7): 1279-1284 (2012)

Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont: A fast moisture sensitivity level qualification method. Microelectronics Reliability 50(9-11): 1654-1660 (2010)

J. J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang: Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. Microelectronics Reliability 49(8): 846-852 (2009)

Olaf van der Sluis, R. A. B. Engelen, P. H. M. Timmermans, G. Q. Zhang: Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics. Microelectronics Reliability 49(8): 853-860 (2009)

Y. Liu, F. J. H. G. Kessels, Willem D. van Driel, J. A. S. van Driel, F. L. Sun, G. Q. Zhang: Comparing drop impact test method using strain gauge measurements. Microelectronics Reliability 49(9-11): 1299-1303 (2009)

S. P. M. Noijen, Olaf van der Sluis, P. H. M. Timmermans, G. Q. Zhang: Numerical prediction of failure paths at a roughened metal/polymer interface. Microelectronics Reliability 49(9-11): 1315-1318 (2009)

Cadmus A. Yuan, Olaf van der Sluis, Willem D. van Driel, G. Q. (Kouchi) Zhang: The need for multi-scale approaches in Cu/low-k reliability issues. Microelectronics Reliability 48(6): 833-842 (2008)

F. Sun, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang: Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP. Microelectronics Reliability 48(8-9): 1167-1170 (2008)

W. D. van Driel, D. G. Yang, G. Q. Zhang: On chip-package stress interaction. Microelectronics Reliability 48(8-9): 1268-1272 (2008)

Q. Li, J. F. L. Goosen, J. T. M. van Beek, F. van Keulen, K. L. Phan, G. Q. Zhang: Failure analysis of a thin-film nitride MEMS package. Microelectronics Reliability 48(8-9): 1557-1561 (2008)

J. J. M. Zaal, W. D. van Driel, S. Bendida, Q. Li, J. T. M. van Beek, G. Q. Zhang: Packaging influences on the reliability of MEMS resonators. Microelectronics Reliability 48(8-9): 1567-1571 (2008)

M. A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken: Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectronics Reliability 47(2-3): 179-186 (2007)

W. D. van Driel, A. Mavinkurve, M. A. J. van Gils, G. Q. Zhang: Advanced structural similarity rules for the BGA package family. Microelectronics Reliability 47(2-3): 205-214 (2007)

D. G. Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen: Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectronics Reliability 47(2-3): 233-239 (2007)

C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, D. G. Yang, G. Q. Zhang, H. J. L. Bressers: Novel shear tools for viscoelastic characterization of packaging polymers. Microelectronics Reliability 47(2-3): 240-247 (2007)

V. Gonda, Kaspar M. B. Jansen, Leo J. Ernst, J. den Toonder, G. Q. Zhang: Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. Microelectronics Reliability 47(2-3): 248-251 (2007)

M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen: Virtual qualification of moisture induced failures of advanced packages. Microelectronics Reliability 47(2-3): 273-279 (2007)

Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang: Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. Microelectronics Reliability 47(2-3): 280-289 (2007)

H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang: Correlation between chemistry of polymer building blocks and microelectronics reliability. Microelectronics Reliability 47(2-3): 290-294 (2007)

D. G. Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen: Numerical modeling of warpage induced in QFN array molding process. Microelectronics Reliability 47(2-3): 310-318 (2007)

Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout: Molecular simulation on the material/interfacial strength of the low-dielectric materials. Microelectronics Reliability 47(9-11): 1483-1491 (2007)

Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang: Characterization of moisture properties of polymers for IC packaging. Microelectronics Reliability 47(9-11): 1685-1689 (2007)

Willem D. van Driel, D. G. Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang: Mechanical reliability challenges for MEMS packages: Capping. Microelectronics Reliability 47(9-11): 1823-1826 (2007)

G. Q. Zhang, K. K. Lai: Combining path relinking and genetic algorithms for the multiple-level warehouse layout problem. European Journal of Operational Research 169(2): 413-425 (2006)

A. J. van Roosmalen, G. Q. Zhang: Reliability challenges in the nanoelectronics era. Microelectronics Reliability 46(9-11): 1403-1414 (2006)

R. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang: Multiscale modelling of multilayer substrates. Microelectronics Reliability 46(9-11): 1472-1477 (2006)

C. Yuan, W. D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, R. A. B. Engelen, Leo J. Ernst, F. van Keulen, G. Q. Zhang: Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectronics Reliability 46(9-11): 1679-1684 (2006)

W. D. van Driel, Olaf van der Sluis, D. G. Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang: Reliability modelling for packages in flexible end-products. Microelectronics Reliability 46(9-11): 1880-1885 (2006)

W. D. van Driel, M. A. J. van Gils, Richard B. R. van Silfhout, G. Q. Zhang: Prediction of Delamination Related IC & Packaging Reliability Problems. Microelectronics Reliability 45(9-11): 1633-1638 (2005)

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi: Prediction and verification of process induced warpage of electronic packages. Microelectronics Reliability 43(5): 765-774 (2003)

G. Q. Zhang: The challenges of virtual prototyping and qualification for future microelectronics. Microelectronics Reliability 43(9-11): 1777-1783 (2003)